Technical University of Madrid
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Electrical and Optical Engineering Facilities
Micro- and Nanotechnology facilities
Chemistry and Material Sciences
Information Science and Technology
Evaporation by electron beam of different metals: Au, Pt, Ti, Al, etc.
Characterization of optoelectronic devices (detector, emitters, etc.).
SEM, AFM and high resolution XRD.
Etching of different materials.
Deposition of magnetic thin films ((Fe, Ni, Co, FeNi, etc.).
Growth of Arsenides and Nitrides semiconductor compounds.
Hall-effect, VSM.
Evaporation by Joule effect of different metals: Au, AuGe, AuZn, Ni, etc.
Deposition of SiN and SiO layers.
Photoluminescence analysis.
Optical lithography and e-beam lithography.
System dedicated to measure thicknesses.
Systems dedicated to the growth of magnetic heterostructures.
Joule and e-beam evaporators for metal (Ti, Al, Mo, Ni, Au, etc) deposition.
Plasma-assisted reactive ion etching system.
System dedicated to analyze surface morphology.
4 MBEs systems dedicated to the growth of Arsenides and Nitrides semiconductor compounds.
Electron beam nanolithography system with line resolution of 10 nm.
System dedicated to obtain electrical properties of thin films.
System dedicated to characterize magnetic thin films.
Systems for depositing dielectric materials (SiN, SiO, etc).
Systems for soldering micro wires.
Standard optical enhanced lithography system with resolution >1 μm.
Systems dedicated to electrical characterization of different types of optoelectronic devices.
System dedicated to obtaining morphology data and chemical analysis.
Photoluminescence systems with cryostat allowing measuring optical properties from 10K to room temperature.
Electrical characterization of devices with frequency up to 20 GHz.
System dedicated to obtain information on the surface morphology.
System dedicated to characterize (electrically and optically) semiconductor materials and optoelectronic devices from room temperature up to 400°C and high frequency (up to 1 GHz) (C-V. I-V, C-f, 1/f noise, T, etc.).
Systems used for annealing of contacts and re-ordering of different materials.
System for dicing different type of wafers.
Systems dedicated to determining crystal structures by performing different types of profiles.