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Swedish Research Infrastructure for Micro- and Nanofabrication (Myfab)
Identification
Hosting Legal Entity
|
Chalmers University of Technology
|
Location
Lägerhyddsvägen 1, Ångström Microstructure LaboratoryUppsala University, Uppsala, PO: 75121 (Sweden)
Structure
Type Of RI
Distributed
Coordinating Country
Sweden
Status
Status
Current Status:
Operational
since 2004
Scientific Description
Myfab offers distributed high-quality cleanroom facilities and associated expertise for advanced research and education to researchers and product developers at universities and high tech industries. Here you get access to the best equipment you can find in Sweden, to give your research and technical development the possibilities they deserve.
RI Keywords
Lithography, Nanotechnology, E-beam, Epitaxy, Microfabrication, Open-access, Microtechnology, Clean-room, Nanofabrication, Micro, Ion-beam, Nano
Classifications
RI Category
Mechanical Engineering Facilities
Micro- and Nanotechnology facilities
Electrical and Optical Engineering Facilities
Extreme Conditions Facilities
Materials Synthesis or Testing Facilities
Micro- and Nanotechnology facilities
Electrical and Optical Engineering Facilities
Extreme Conditions Facilities
Materials Synthesis or Testing Facilities
Scientific Domain
Biological and Medical Sciences
Information Science and Technology
Earth and Environmental Sciences
Engineering and Energy
Physics, Astronomy, Astrophysics and Mathematics
Chemistry and Material Sciences
Information Science and Technology
Earth and Environmental Sciences
Engineering and Energy
Physics, Astronomy, Astrophysics and Mathematics
Chemistry and Material Sciences
ESFRI Domain
Physical Sciences and Engineering
Services
Open access to clean-room based nanofabrication and characterization equipment and expertize
Open access to more than 600 tools in three cleanrooms, user support, user training, education and process service.
Equipment
More than 700 tools for nanotechnology and characterization
Electron beam lithography (high resolution), thin film deposition, several etching methods, ion implantation, thermal processing, MBE, MOCVD, die mounting, back-end assembly, a large number of characterization techniques (SEM, FIB, TEM, XPS, ...). Processes established for e.g. silicon technologies, III-V and photonic devices and quantum devices. See: http://myfab.se and subpages therein for all tools and their descriptions.
Date of last update: 22/02/2019
