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INESC-Microsystems and Nanotechnologies (INESC-MN)
Hosting Legal Entity
Self-standing RI
Legal Status
Research organisation
Rua Alves Redol, 9, INESC, Lisboa, PO: 1000-029 (Portugal)
Type Of RI
Coordinating Country
Current Status:
Operational since 2002
Scientific Description
INESC MN is a private non profit research organization operating a class 10 and class 100 clean room facility with major research areas in spintronics, MEMS, thin film devices, and biosensors and biomedical devices.

RI Keywords
MEMS, Nanotechnology, Biosensors, Microfluidics, Biomedical Sciences, Microsystems, Spintronics
RI Category
Micro- and Nanotechnology facilities
Electrical and Optical Engineering Facilities
Biological/Biomedical Engineering and Biotechnology/Nanotechnology Research Facilities
Scientific Domain
Physics, Astronomy, Astrophysics and Mathematics
Chemistry and Material Sciences
ESFRI Domain
Physical Sciences and Engineering
Material deposition and etching
Optoelectronics characterizations
Integrated Processing and solutions for devices

INESC MN can provide integrated processing of films and devices by combining different technologies and equipment into a customized or semi-customized service.

Processing of soft lithographic techniques (SU8, PDMS) for microfluidics
Magnetoresistance measurement setups
X-ray diffractometer
Vibrating Sample magnetometer
Spin coating
Class 100 cleanroom area
Nordiko 3000

Ion beam deposition and milling - 6 inch wafer processing, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, Pt, MgO, AlOx, Al, Au, Ti)

Nordiko 3600

ion beam deposition and milling - 8 inch wafer, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, MgO, AlOx, Al, NiFeCr)

Rudolf ellipsometer
Dektak profilometer
Nordiko 7000

Magnetron sputtering - 6 inch wafer processing,

Aixtron NanoInstruments Black Magic

2-inch Plasma Enhanced Chemical Vapour Deposition system for graphene and nanotube growth, with methane, acetylene, hydrogen, ammonia, nitrogen and argon gas supply.

Diffusion/passivation furnaces
Nordiko 2000

Magnetron and RF sputtering

Dicing saw
Optical detection of electromechanical deflection (in air and vacuum)

RF sputtering - 6 inch wafer processing, 1 target (Al2O3)


magnetron sputtering - 6 inch wafer processing, 1 target (mosaic CoZrNb)

GeSiM Nano-Plotter
Class 10 lithography area
Automated lapping tool
Olympus optical microscope
Hitachi Scanning Electron microscope
Ion-beam milling systems
RAITH 150 electron beam lithograph
Reactive ion etching system
Fluorescence microscope
Plasma enhanced chemical vapor deposition systems
Heidelberg DWLii direct write laser lithography

Deposition of SiO2, Cr, Al, ITO, IZO, AZO, GeSbTe, Si, Ti, Ni

Access Type
Physical, Mail-in
Access Mode
Users Definition
User Demographics
Extra-European Users - 31.0% in 2017
National Users - 46.0% in 2017
European Users - 23.0% in 2017
Type of Users
Public research organisations - 34.0%
Academic - 34.0%
Industry/private companies - 31.0%
Date of last update: 06/03/2018
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