Micro- and Nanotechnology facilities
Electrical and Optical Engineering Facilities
Physics, Astronomy, Astrophysics and Mathematics
INESC MN can provide integrated processing of films and devices by combining different technologies and equipment into a customized or semi-customized service.
magnetron sputtering - 6 inch wafer processing, 1 target (mosaic CoZrNb)
Magnetron sputtering - 6 inch wafer processing,
Ion beam deposition and milling - 6 inch wafer processing, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, Pt, MgO, AlOx, Al, Au, Ti)
RF sputtering - 6 inch wafer processing, 1 target (Al2O3)
ion beam deposition and milling - 8 inch wafer, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, MgO, AlOx, Al, NiFeCr)
Magnetron and RF sputtering
Deposition of SiO2, Cr, Al, ITO, IZO, AZO, GeSbTe, Si, Ti, Ni
2-inch Plasma Enhanced Chemical Vapour Deposition system for graphene and nanotube growth, with methane, acetylene, hydrogen, ammonia, nitrogen and argon gas supply.