Micro- and Nanotechnology facilities
Electrical and Optical Engineering Facilities
Physics, Astronomy, Astrophysics and Mathematics
INESC MN can provide integrated processing of films and devices by combining different technologies and equipment into a customized or semi-customized service.
magnetron sputtering - 6 inch wafer processing, 1 target (mosaic CoZrNb)
ion beam deposition and milling - 8 inch wafer, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, MgO, AlOx, Al, NiFeCr)
Magnetron sputtering - 6 inch wafer processing,
RF sputtering - 6 inch wafer processing, 1 target (Al2O3)
2-inch Plasma Enhanced Chemical Vapour Deposition system for graphene and nanotube growth, with methane, acetylene, hydrogen, ammonia, nitrogen and argon gas supply.
Ion beam deposition and milling - 6 inch wafer processing, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, Pt, MgO, AlOx, Al, Au, Ti)
Deposition of SiO2, Cr, Al, ITO, IZO, AZO, GeSbTe, Si, Ti, Ni
Magnetron and RF sputtering