Middle East Technical University
|
|
Address:
|
Ankara Üniversitesi, Ankara, PO: 06110 (Turkey)
|
MEMS device fabrication; MEMS-based fabrication porcesses (thin film deposition, etching etc.).
Device-level testing; material characterization.
MEMS device design.
Bestec Manual Loading (Cr, Ti, NiCr, Au) 4-6".
EVG 810 LT Plasma Activation.
İPEC 472 Wafer Polisher 4-6-8".
PRIMAXX MEMS NGCET VAPOR HF ETCHER 4-6-8".
Idonus IR Microscope.
RCA cleaning prior to high-temperature treatment, Atmospheric thermal dry oxidation, Atmospheric thermal wet oxidation, High temperature drive-in under inert atmosphere, 5 furnaces, THERMCO.
STS Multiplex RIE System for 4", 6" , and 8" wafers (Silicon Dioxide, Silicon nitride, BCB, Polyimide, Parylene).
AJA1/2/3 (Cr, Ti, Au, Cu, Ni, Al) 4-6", 3 separate chambers, Co-sputtering capability.
Newwave WAVN Quicklase 50ST laser cutter.
Kluicke & Soffa Manual Wedge Bonder Model 4500.
TRESKY 3002 FC3 DIE BONDER.
4-6-8" compatible wet benches (Silicon dioxide etching with BHF solution, Silicon nitride etching, Anisotropic silicon etching using KOH, TMAH, and EDP, Isotropic silicon etching using HNA, Electrochemical etching using KOH and TMAH solutions, Metal etching: Al, Cu, Ti, Ni, Cr, Au, Resist stripping in organic solvents).
DISCO DAD 3350 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 8", with circle cut capability.
Kluicke & Soffa Manual Universal Thermosonic Gold Ball Bonder Model 4124.
Essemtec UP3100 manual placement system for BGA, CSP, and Fine Pitch components.
Varian Thermal Evaporator (Cr, Ti, Au) 4-6".
Bidtec Manual Spinner 4-6".
Lucas Signatone 200 mm manual analytic probe station.
EVG 520IS 4-6-8" Wafer Bonder (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
TOUSIMIS 916B CRITICAL POINT DRYER, 4-6-8".
EVG 620 Precision Alignment System & Bond Aligner for 4" and 6" wafers.
PDS 2000 Parylene Deposition System.
Xactix X4 Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas.
ASML PAS 5500/200B Stepper (0.35µm resolution).
SPTS Omega i2L APS RIE 6"-8" Wafers (SiO2, SixNy, polyimide).
TOHO TECHNOLOGY FLX-2320-S Wafer-Level Stress Measurement System.
FTIR-210 IR-VASE Elipsometer.
SUSS PAV 200 Automatic Probe Station with vacuum chamber, heat controlled chuck, Polytec MSA-500 dynamic MEMS analyser capability and chamber window for IR application.
SET FC150 Automated Die / Flip Chip Bonder.
Suss LabSpin 8 Manual Spinner 4-6-8".
Veeco Dektak 8 Profiler 4-6".
Veeco Wyko NT 1100 Optical Profiler.
QuadPro Four Point Probe Measurement System with heat controlled chuck.
Varian Thermal Evaporator (Sn) 4-6".
STS Multiplex ASE HRM System for 4" 6" wafers, and 8".
Nikon LV 150, 150x 8"-compatible optical microscope (2 pieces).
AJA e-beam evapoator (Ti, Cr, Pt, Au, Al) 4-6".
Magnetron Model M-700 Four Point Probe System.
Delvotec Au ball bonder (Semi-Auto).
FIBRoplate process, uniformly on 4" & 6" wafers (Au, Ni, and Cu).
TOUSIMIS 915B CRITICAL POINT DRYER, 4-6".
STS Multiplex ICP System for 4", 6" , and 8" wafers (Au, Ti, SiCr, Cr, Al).
Nanospec/AFT Computerized Film Thickness Measurement System.
Nikon 100x microscopes.
Suss ACS200 Automatic coater/Spray coater 4-6-8" (2 spin, 2 develop, 1 spray, 1 bake, 1 HMDS stations).
Hirox KH7700 3D digital microscope.
POLARIS ACCUWELD-4270 VACUUM PACKAGING.
EVG 501 Universal Bonder 4" and 6" (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
Airborn particle scanner.
SPTS Delta i2L APM PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si)).
DISCO DAD 321 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 6".
STS Multiplex PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si), Phosphosilicate glass (PSG), Borosilicate glass (BSG), Waveguide silicon dioxide (W-SiO2)).
Nanoplus - 1,Nanoplus - 2,Branson IPC.
Boron diffusion using BBr3 and B2H6 gases, Phosphorus diffusion using POCl3 gas, 26 furnaces, THERMCO.
Delvotec Al wedge bonder (Semi-Auto).
Bestec Automatic Loading (Cr, Ti, NiCr, Au) 4-6-8" Co-sputtering capability.
JEOL Scanning Electron Microscope (SEM) up to 8", automatic loading, EDS option.
HIMT DWL200 Laser Direct Writing 1µm resolution.
EVG 301 Wafer and Mask Cleaner.
TEMPRESS LPCVD SYSTEM, 4 tubes, 4-6", Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy) and polysilicon.
STS Multiplex, Pegasus for 4" 6", and 8" wafers.
Strasbaugh 7AF 4-6-8" Wafer grinder.
EVG 6200 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers.