Middle East Technical University
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Address:
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Ankara Üniversitesi, Ankara, PO: 06110 (Turkey)
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MEMS device fabrication; MEMS-based fabrication porcesses (thin film deposition, etching etc.).
Device-level testing; material characterization.
MEMS device design.
EVG 620 Precision Alignment System & Bond Aligner for 4" and 6" wafers.
SPTS Omega i2L APS RIE 6"-8" Wafers (SiO2, SixNy, polyimide).
Kluicke & Soffa Manual Wedge Bonder Model 4500.
PRIMAXX MEMS NGCET VAPOR HF ETCHER 4-6-8".
Essemtec UP3100 manual placement system for BGA, CSP, and Fine Pitch components.
Magnetron Model M-700 Four Point Probe System.
EVG 520IS 4-6-8" Wafer Bonder (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
STS Multiplex ICP System for 4", 6" , and 8" wafers (Au, Ti, SiCr, Cr, Al).
HIMT DWL200 Laser Direct Writing 1µm resolution.
Airborn particle scanner.
Nanospec/AFT Computerized Film Thickness Measurement System.
Lucas Signatone 200 mm manual analytic probe station.
Xactix X4 Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas.
Newwave WAVN Quicklase 50ST laser cutter.
JEOL Scanning Electron Microscope (SEM) up to 8", automatic loading, EDS option.
STS Multiplex RIE System for 4", 6" , and 8" wafers (Silicon Dioxide, Silicon nitride, BCB, Polyimide, Parylene).
TOUSIMIS 915B CRITICAL POINT DRYER, 4-6".
EVG 6200 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers.
TEMPRESS LPCVD SYSTEM, 4 tubes, 4-6", Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy) and polysilicon.
TOHO TECHNOLOGY FLX-2320-S Wafer-Level Stress Measurement System.
Bidtec Manual Spinner 4-6".
Nikon LV 150, 150x 8"-compatible optical microscope (2 pieces).
STS Multiplex ASE HRM System for 4" 6" wafers, and 8".
SUSS PAV 200 Automatic Probe Station with vacuum chamber, heat controlled chuck, Polytec MSA-500 dynamic MEMS analyser capability and chamber window for IR application.
DISCO DAD 3350 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 8", with circle cut capability.
STS Multiplex, Pegasus for 4" 6", and 8" wafers.
4-6-8" compatible wet benches (Silicon dioxide etching with BHF solution, Silicon nitride etching, Anisotropic silicon etching using KOH, TMAH, and EDP, Isotropic silicon etching using HNA, Electrochemical etching using KOH and TMAH solutions, Metal etching: Al, Cu, Ti, Ni, Cr, Au, Resist stripping in organic solvents).
Varian Thermal Evaporator (Sn) 4-6".
FTIR-210 IR-VASE Elipsometer.
Suss ACS200 Automatic coater/Spray coater 4-6-8" (2 spin, 2 develop, 1 spray, 1 bake, 1 HMDS stations).
Varian Thermal Evaporator (Cr, Ti, Au) 4-6".
Delvotec Al wedge bonder (Semi-Auto).
Hirox KH7700 3D digital microscope.
Strasbaugh 7AF 4-6-8" Wafer grinder.
Bestec Manual Loading (Cr, Ti, NiCr, Au) 4-6".
FIBRoplate process, uniformly on 4" & 6" wafers (Au, Ni, and Cu).
Bestec Automatic Loading (Cr, Ti, NiCr, Au) 4-6-8" Co-sputtering capability.
Nanoplus - 1,Nanoplus - 2,Branson IPC.
PDS 2000 Parylene Deposition System.
EVG 501 Universal Bonder 4" and 6" (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
Veeco Dektak 8 Profiler 4-6".
Boron diffusion using BBr3 and B2H6 gases, Phosphorus diffusion using POCl3 gas, 26 furnaces, THERMCO.
SPTS Delta i2L APM PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si)).
STS Multiplex PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si), Phosphosilicate glass (PSG), Borosilicate glass (BSG), Waveguide silicon dioxide (W-SiO2)).
RCA cleaning prior to high-temperature treatment, Atmospheric thermal dry oxidation, Atmospheric thermal wet oxidation, High temperature drive-in under inert atmosphere, 5 furnaces, THERMCO.
QuadPro Four Point Probe Measurement System with heat controlled chuck.
Veeco Wyko NT 1100 Optical Profiler.
SET FC150 Automated Die / Flip Chip Bonder.
İPEC 472 Wafer Polisher 4-6-8".
Suss LabSpin 8 Manual Spinner 4-6-8".
TRESKY 3002 FC3 DIE BONDER.
AJA e-beam evapoator (Ti, Cr, Pt, Au, Al) 4-6".
ASML PAS 5500/200B Stepper (0.35µm resolution).
DISCO DAD 321 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 6".
Idonus IR Microscope.
EVG 810 LT Plasma Activation.
POLARIS ACCUWELD-4270 VACUUM PACKAGING.
TOUSIMIS 916B CRITICAL POINT DRYER, 4-6-8".
AJA1/2/3 (Cr, Ti, Au, Cu, Ni, Al) 4-6", 3 separate chambers, Co-sputtering capability.
Kluicke & Soffa Manual Universal Thermosonic Gold Ball Bonder Model 4124.
EVG 301 Wafer and Mask Cleaner.
Nikon 100x microscopes.
Delvotec Au ball bonder (Semi-Auto).