Middle East Technical University
Ankara Üniversitesi, Ankara, PO: 06110 (Turkey)
As a result, a considerable amount of knowledge and experience has been gained, and the first MEMS center was established in Turkey in 2008 as the METU-MEMS Center. At the METU-MEMS Center a wide variety of microsensors and components has been and is being developed, including low-cost CMOS infrared detectors, accelerometers, gyroscopes, DNA analysis systems, biosensors, micro power generators, chip cooling systems, acoustic sensors, humidity sensors, temperature sensors, frost sensors, piezoresistive and capacitive pressure sensors, and various RF MEMS components. Some of the developed prototypes show performance comparable to the best examples in the world, and efforts to commercialize these microsensors and microsystems are continuing.
In the past 15 years, the METU-MEMS Center has collaborated with a number of national/international partners such as IMEC (one of the largest microelectronics/MEMS center in Europe), Intel, the University of Michigan at Ann Arbor, Arizona State University, the Massachusetts Institute of Technology, ASELSAN, TOFAS, and ARCELIK (also known as BEKO). With the help of these collaborations and the success of the projects, the METU-MEMS Center has gained well-deserved recognition both in national and international arenas. Based on this reputation, the IEEE/ASME MEMS 2006 conference was held in Istanbul, Turkey. The Center has recently been awarded a European Union 7th Framework Programme (EU-FP7) Regional Potentials (REGPOT) Project (METU-MEMS).
The current goal of the METU-MEMS Center is to be a center of excellence in MEMS field, serving national and international research and technology for industrial development.
Device-level testing; material characterization.
MEMS device design.
MEMS device fabrication; MEMS-based fabrication porcesses (thin film deposition, etching etc.).
Nanospec/AFT Computerized Film Thickness Measurement System.
STS Multiplex ASE HRM System for 4" 6" wafers, and 8".
Bestec Automatic Loading (Cr, Ti, NiCr, Au) 4-6-8" Co-sputtering capability.
Newwave WAVN Quicklase 50ST laser cutter.
4-6-8" compatible wet benches (Silicon dioxide etching with BHF solution, Silicon nitride etching, Anisotropic silicon etching using KOH, TMAH, and EDP, Isotropic silicon etching using HNA, Electrochemical etching using KOH and TMAH solutions, Metal etching: Al, Cu, Ti, Ni, Cr, Au, Resist stripping in organic solvents).
SPTS Delta i2L APM PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si)).
Nanoplus - 1,Nanoplus - 2,Branson IPC.
Delvotec Al wedge bonder (Semi-Auto).
EVG 501 Universal Bonder 4" and 6" (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
Boron diffusion using BBr3 and B2H6 gases, Phosphorus diffusion using POCl3 gas, 26 furnaces, THERMCO.
Veeco Dektak 8 Profiler 4-6".
Suss ACS200 Automatic coater/Spray coater 4-6-8" (2 spin, 2 develop, 1 spray, 1 bake, 1 HMDS stations).
Nikon 100x microscopes.
RCA cleaning prior to high-temperature treatment, Atmospheric thermal dry oxidation, Atmospheric thermal wet oxidation, High temperature drive-in under inert atmosphere, 5 furnaces, THERMCO.
Varian Thermal Evaporator (Sn) 4-6".
STS Multiplex RIE System for 4", 6" , and 8" wafers (Silicon Dioxide, Silicon nitride, BCB, Polyimide, Parylene).
SET FC150 Automated Die / Flip Chip Bonder.
SUSS PAV 200 Automatic Probe Station with vacuum chamber, heat controlled chuck, Polytec MSA-500 dynamic MEMS analyser capability and chamber window for IR application.
PRIMAXX MEMS NGCET VAPOR HF ETCHER 4-6-8".
TEMPRESS LPCVD SYSTEM, 4 tubes, 4-6", Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy) and polysilicon.
Varian Thermal Evaporator (Cr, Ti, Au) 4-6".
Suss LabSpin 8 Manual Spinner 4-6-8".
İPEC 472 Wafer Polisher 4-6-8".
STS Multiplex, Pegasus for 4" 6", and 8" wafers.
FIBRoplate process, uniformly on 4" & 6" wafers (Au, Ni, and Cu).
EVG 301 Wafer and Mask Cleaner.
Xactix X4 Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas.
Airborn particle scanner.
Hirox KH7700 3D digital microscope.
EVG 520IS 4-6-8" Wafer Bonder (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
EVG 6200 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers.
AJA1/2/3 (Cr, Ti, Au, Cu, Ni, Al) 4-6", 3 separate chambers, Co-sputtering capability.
EVG 810 LT Plasma Activation.
POLARIS ACCUWELD-4270 VACUUM PACKAGING.
HIMT DWL200 Laser Direct Writing 1µm resolution.
JEOL Scanning Electron Microscope (SEM) up to 8", automatic loading, EDS option.
Magnetron Model M-700 Four Point Probe System.
EVG 620 Precision Alignment System & Bond Aligner for 4" and 6" wafers.
Nikon LV 150, 150x 8"-compatible optical microscope (2 pieces).
ASML PAS 5500/200B Stepper (0.35µm resolution).
Idonus IR Microscope.
DISCO DAD 3350 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 8", with circle cut capability.
Bidtec Manual Spinner 4-6".
Veeco Wyko NT 1100 Optical Profiler.
STS Multiplex PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si), Phosphosilicate glass (PSG), Borosilicate glass (BSG), Waveguide silicon dioxide (W-SiO2)).
Kluicke & Soffa Manual Wedge Bonder Model 4500.
Lucas Signatone 200 mm manual analytic probe station.
FTIR-210 IR-VASE Elipsometer.
PDS 2000 Parylene Deposition System.
TRESKY 3002 FC3 DIE BONDER.
STS Multiplex ICP System for 4", 6" , and 8" wafers (Au, Ti, SiCr, Cr, Al).
QuadPro Four Point Probe Measurement System with heat controlled chuck.
AJA e-beam evapoator (Ti, Cr, Pt, Au, Al) 4-6".
Bestec Manual Loading (Cr, Ti, NiCr, Au) 4-6".
SPTS Omega i2L APS RIE 6"-8" Wafers (SiO2, SixNy, polyimide).
Kluicke & Soffa Manual Universal Thermosonic Gold Ball Bonder Model 4124.
DISCO DAD 321 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 6".
TOUSIMIS 915B CRITICAL POINT DRYER, 4-6".
Delvotec Au ball bonder (Semi-Auto).
Essemtec UP3100 manual placement system for BGA, CSP, and Fine Pitch components.
TOHO TECHNOLOGY FLX-2320-S Wafer-Level Stress Measurement System.
TOUSIMIS 916B CRITICAL POINT DRYER, 4-6-8".
Strasbaugh 7AF 4-6-8" Wafer grinder.