Middle East Technical University
Ankara Üniversitesi, Ankara, PO: 06110 (Turkey)
As a result, a considerable amount of knowledge and experience has been gained, and the first MEMS center was established in Turkey in 2008 as the METU-MEMS Center. At the METU-MEMS Center a wide variety of microsensors and components has been and is being developed, including low-cost CMOS infrared detectors, accelerometers, gyroscopes, DNA analysis systems, biosensors, micro power generators, chip cooling systems, acoustic sensors, humidity sensors, temperature sensors, frost sensors, piezoresistive and capacitive pressure sensors, and various RF MEMS components. Some of the developed prototypes show performance comparable to the best examples in the world, and efforts to commercialize these microsensors and microsystems are continuing.
In the past 15 years, the METU-MEMS Center has collaborated with a number of national/international partners such as IMEC (one of the largest microelectronics/MEMS center in Europe), Intel, the University of Michigan at Ann Arbor, Arizona State University, the Massachusetts Institute of Technology, ASELSAN, TOFAS, and ARCELIK (also known as BEKO). With the help of these collaborations and the success of the projects, the METU-MEMS Center has gained well-deserved recognition both in national and international arenas. Based on this reputation, the IEEE/ASME MEMS 2006 conference was held in Istanbul, Turkey. The Center has recently been awarded a European Union 7th Framework Programme (EU-FP7) Regional Potentials (REGPOT) Project (METU-MEMS).
The current goal of the METU-MEMS Center is to be a center of excellence in MEMS field, serving national and international research and technology for industrial development.
MEMS device fabrication; MEMS-based fabrication porcesses (thin film deposition, etching etc.).
MEMS device design.
Device-level testing; material characterization.
FTIR-210 IR-VASE Elipsometer.
SPTS Delta i2L APM PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si)).
Hirox KH7700 3D digital microscope.
Kluicke & Soffa Manual Wedge Bonder Model 4500.
QuadPro Four Point Probe Measurement System with heat controlled chuck.
EVG 620 Precision Alignment System & Bond Aligner for 4" and 6" wafers.
Suss ACS200 Automatic coater/Spray coater 4-6-8" (2 spin, 2 develop, 1 spray, 1 bake, 1 HMDS stations).
RCA cleaning prior to high-temperature treatment, Atmospheric thermal dry oxidation, Atmospheric thermal wet oxidation, High temperature drive-in under inert atmosphere, 5 furnaces, THERMCO.
Nikon 100x microscopes.
PRIMAXX MEMS NGCET VAPOR HF ETCHER 4-6-8".
EVG 501 Universal Bonder 4" and 6" (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
Veeco Wyko NT 1100 Optical Profiler.
Strasbaugh 7AF 4-6-8" Wafer grinder.
Delvotec Al wedge bonder (Semi-Auto).
SUSS PAV 200 Automatic Probe Station with vacuum chamber, heat controlled chuck, Polytec MSA-500 dynamic MEMS analyser capability and chamber window for IR application.
TEMPRESS LPCVD SYSTEM, 4 tubes, 4-6", Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy) and polysilicon.
PDS 2000 Parylene Deposition System.
Varian Thermal Evaporator (Cr, Ti, Au) 4-6".
Bestec Manual Loading (Cr, Ti, NiCr, Au) 4-6".
SPTS Omega i2L APS RIE 6"-8" Wafers (SiO2, SixNy, polyimide).
Nanospec/AFT Computerized Film Thickness Measurement System.
HIMT DWL200 Laser Direct Writing 1µm resolution.
AJA1/2/3 (Cr, Ti, Au, Cu, Ni, Al) 4-6", 3 separate chambers, Co-sputtering capability.
EVG 810 LT Plasma Activation.
STS Multiplex, Pegasus for 4" 6", and 8" wafers.
POLARIS ACCUWELD-4270 VACUUM PACKAGING.
Idonus IR Microscope.
Nanoplus - 1,Nanoplus - 2,Branson IPC.
STS Multiplex RIE System for 4", 6" , and 8" wafers (Silicon Dioxide, Silicon nitride, BCB, Polyimide, Parylene).
Newwave WAVN Quicklase 50ST laser cutter.
Boron diffusion using BBr3 and B2H6 gases, Phosphorus diffusion using POCl3 gas, 26 furnaces, THERMCO.
DISCO DAD 3350 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 8", with circle cut capability.
JEOL Scanning Electron Microscope (SEM) up to 8", automatic loading, EDS option.
FIBRoplate process, uniformly on 4" & 6" wafers (Au, Ni, and Cu).
Kluicke & Soffa Manual Universal Thermosonic Gold Ball Bonder Model 4124.
Xactix X4 Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas.
Suss LabSpin 8 Manual Spinner 4-6-8".
Veeco Dektak 8 Profiler 4-6".
ASML PAS 5500/200B Stepper (0.35µm resolution).
Nikon LV 150, 150x 8"-compatible optical microscope (2 pieces).
EVG 6200 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers.
Varian Thermal Evaporator (Sn) 4-6".
AJA e-beam evapoator (Ti, Cr, Pt, Au, Al) 4-6".
DISCO DAD 321 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 6".
EVG 520IS 4-6-8" Wafer Bonder (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).
STS Multiplex ASE HRM System for 4" 6" wafers, and 8".
STS Multiplex PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si), Phosphosilicate glass (PSG), Borosilicate glass (BSG), Waveguide silicon dioxide (W-SiO2)).
Essemtec UP3100 manual placement system for BGA, CSP, and Fine Pitch components.
Airborn particle scanner.
TRESKY 3002 FC3 DIE BONDER.
TOUSIMIS 915B CRITICAL POINT DRYER, 4-6".
Bestec Automatic Loading (Cr, Ti, NiCr, Au) 4-6-8" Co-sputtering capability.
Delvotec Au ball bonder (Semi-Auto).
Lucas Signatone 200 mm manual analytic probe station.
Bidtec Manual Spinner 4-6".
TOUSIMIS 916B CRITICAL POINT DRYER, 4-6-8".
EVG 301 Wafer and Mask Cleaner.
STS Multiplex ICP System for 4", 6" , and 8" wafers (Au, Ti, SiCr, Cr, Al).
4-6-8" compatible wet benches (Silicon dioxide etching with BHF solution, Silicon nitride etching, Anisotropic silicon etching using KOH, TMAH, and EDP, Isotropic silicon etching using HNA, Electrochemical etching using KOH and TMAH solutions, Metal etching: Al, Cu, Ti, Ni, Cr, Au, Resist stripping in organic solvents).
İPEC 472 Wafer Polisher 4-6-8".
TOHO TECHNOLOGY FLX-2320-S Wafer-Level Stress Measurement System.
Magnetron Model M-700 Four Point Probe System.
SET FC150 Automated Die / Flip Chip Bonder.