You are here: Home / Infrastructures / Res. Infrastructure
Micro-Electro-Mechanical Systems Research and Application Center (METU-MEMS)
Identification
Hosting Legal Entity
Middle East Technical University
Address:
Ankara Üniversitesi, Ankara, PO: 06110 (Turkey)
Location
Eskisehir Yolu 9. Km, Ankara, PO: 06531 (Turkey)
Structure
Type Of RI
Single-sited
Coordinating Country
Turkey
Status
Status
Current Status:
Operational since 2002
Contacts
Public Contact
Akin Tayfun
Scientific Description
MEMS activities at METU started in 1995 within the Electrical and Electronics Engineering Department. Since then a number of research projects have been conducted that are supported by various national and international institutions, including TUBITAK, the State Planning Organization (DPT), MSB Ar-Ge, SSM, the European Union's 6th and 7th Framework Programmes, NATO SfS Programme, NSF, TOFAS, and Intel.



As a result, a considerable amount of knowledge and experience has been gained, and the first MEMS center was established in Turkey in 2008 as the METU-MEMS Center. At the METU-MEMS Center a wide variety of microsensors and components has been and is being developed, including low-cost CMOS infrared detectors, accelerometers, gyroscopes, DNA analysis systems, biosensors, micro power generators, chip cooling systems, acoustic sensors, humidity sensors, temperature sensors, frost sensors, piezoresistive and capacitive pressure sensors, and various RF MEMS components. Some of the developed prototypes show performance comparable to the best examples in the world, and efforts to commercialize these microsensors and microsystems are continuing.

In the past 15 years, the METU-MEMS Center has collaborated with a number of national/international partners such as IMEC (one of the largest microelectronics/MEMS center in Europe), Intel, the University of Michigan at Ann Arbor, Arizona State University, the Massachusetts Institute of Technology, ASELSAN, TOFAS, and ARCELIK (also known as BEKO). With the help of these collaborations and the success of the projects, the METU-MEMS Center has gained well-deserved recognition both in national and international arenas. Based on this reputation, the IEEE/ASME MEMS 2006 conference was held in Istanbul, Turkey. The Center has recently been awarded a European Union 7th Framework Programme (EU-FP7) Regional Potentials (REGPOT) Project (METU-MEMS).

The current goal of the METU-MEMS Center is to be a center of excellence in MEMS field, serving national and international research and technology for industrial development.

RI Keywords
Gyroscope, Microsystems, Rare cell detection, Microtechnology, IMU, BioMEMS, Energy harvesting, Microbolometer, Cell separation, PowerMEMS, RF-MEMS, Accelerometers, IR Sensor, MEMS
Classifications
RI Category
Micro- and Nanotechnology facilities
Scientific Domain
Information Science and Technology
Services
Testing and Characterization

Device-level testing; material characterization.

Design

MEMS device design.

Fabrication

MEMS device fabrication; MEMS-based fabrication porcesses (thin film deposition, etching etc.).

Equipment
Thickness Measurement

Nanospec/AFT Computerized Film Thickness Measurement System.

DRIE-2

STS Multiplex ASE HRM System for 4" 6" wafers, and 8".

Sputter - 2

Bestec Automatic Loading (Cr, Ti, NiCr, Au) 4-6-8" Co-sputtering capability.

Laser Cutter

Newwave WAVN Quicklase 50ST laser cutter.

Etching

4-6-8" compatible wet benches (Silicon dioxide etching with BHF solution, Silicon nitride etching, Anisotropic silicon etching using KOH, TMAH, and EDP, Isotropic silicon etching using HNA, Electrochemical etching using KOH and TMAH solutions, Metal etching: Al, Cu, Ti, Ni, Cr, Au, Resist stripping in organic solvents).

PECVD - 2

SPTS Delta i2L APM PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si)).

O2 Plasma Tools

Nanoplus - 1,Nanoplus - 2,Branson IPC.

Wire Bonder - 4

Delvotec Al wedge bonder (Semi-Auto).

Wafer Bonder - 1

EVG 501 Universal Bonder 4" and 6" (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).

Diffusion

Boron diffusion using BBr3 and B2H6 gases, Phosphorus diffusion using POCl3 gas, 26 furnaces, THERMCO.

Surface Profiler - 1

Veeco Dektak 8 Profiler 4-6".

Spinner - 3 / Spray Coater

Suss ACS200 Automatic coater/Spray coater 4-6-8" (2 spin, 2 develop, 1 spray, 1 bake, 1 HMDS stations).

Microscope - 1

Nikon 100x microscopes.

Dry / Wet Oxidation

RCA cleaning prior to high-temperature treatment, Atmospheric thermal dry oxidation, Atmospheric thermal wet oxidation, High temperature drive-in under inert atmosphere, 5 furnaces, THERMCO.

Evaporator - 3

Varian Thermal Evaporator (Sn) 4-6".

RIE - 1

STS Multiplex RIE System for 4", 6" , and 8" wafers (Silicon Dioxide, Silicon nitride, BCB, Polyimide, Parylene).

Die Bonder

SET FC150 Automated Die / Flip Chip Bonder.

Probe Station

SUSS PAV 200 Automatic Probe Station with vacuum chamber, heat controlled chuck, Polytec MSA-500 dynamic MEMS analyser capability and chamber window for IR application.

Vapor HF etcher

PRIMAXX MEMS NGCET VAPOR HF ETCHER 4-6-8".

Low pressure chemical vapour deposition systems (LPCVD)

TEMPRESS LPCVD SYSTEM, 4 tubes, 4-6", Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy) and polysilicon.

Evaporator - 2

Varian Thermal Evaporator (Cr, Ti, Au) 4-6".

Spinner - 2

Suss LabSpin 8 Manual Spinner 4-6-8".

Chemical Mechanical Polishing (CMP)

İPEC 472 Wafer Polisher 4-6-8".

DRIE-1

STS Multiplex, Pegasus for 4" 6", and 8" wafers.

Electroplating

FIBRoplate process, uniformly on 4" & 6" wafers (Au, Ni, and Cu).

Wafer/Mask Cleaner

EVG 301 Wafer and Mask Cleaner.

Isotropic Si dry etch

Xactix X4 Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas.

Particle Scanner

Airborn particle scanner.

Microscope - 3

Hirox KH7700 3D digital microscope.

Wafer Bonder - 2

EVG 520IS 4-6-8" Wafer Bonder (Silicon to glass anodic bonding, Eutectic bonding, Thermocompression bonding, Fusion Bonding).

Mask/Bond Aligner 4 "-6 "-8 "

EVG 6200 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers.

Sputter 3

AJA1/2/3 (Cr, Ti, Au, Cu, Ni, Al) 4-6", 3 separate chambers, Co-sputtering capability.

Plasma Activation

EVG 810 LT Plasma Activation.

Vacuum Packaging

POLARIS ACCUWELD-4270 VACUUM PACKAGING.

Mask Maker

HIMT DWL200 Laser Direct Writing 1µm resolution.

SEM

JEOL Scanning Electron Microscope (SEM) up to 8", automatic loading, EDS option.

Four Point Probe - 1

Magnetron Model M-700 Four Point Probe System.

Mask/Bond Aligner (4 "-6 ")

EVG 620 Precision Alignment System & Bond Aligner for 4" and 6" wafers.

Microscope - 2

Nikon LV 150, 150x 8"-compatible optical microscope (2 pieces).

Stepper

ASML PAS 5500/200B Stepper (0.35µm resolution).

IR Microscope

Idonus IR Microscope.

Wafer Dicer - 2

DISCO DAD 3350 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 8", with circle cut capability.

Spinner - 1

Bidtec Manual Spinner 4-6".

Surface Profiler - 2

Veeco Wyko NT 1100 Optical Profiler.

Plasma Enhanced Chemical Vapor Deposition (PECVD) - 1

STS Multiplex PECVD System for 4", 6" , and 8" wafers (Silicon dioxide (SiO2), Silicon nitride (SixNy), Stress free silicon nitride (SixNy), Amorphous Si (A-Si), Phosphosilicate glass (PSG), Borosilicate glass (BSG), Waveguide silicon dioxide (W-SiO2)).

Wire Bonder - 2

Kluicke & Soffa Manual Wedge Bonder Model 4500.

Probe Station

Lucas Signatone 200 mm manual analytic probe station.

Ellipsometer

FTIR-210 IR-VASE Elipsometer.

Parylene Deposition System

PDS 2000 Parylene Deposition System.

Die Bonder

TRESKY 3002 FC3 DIE BONDER.

ICP (Metal RIE)

STS Multiplex ICP System for 4", 6" , and 8" wafers (Au, Ti, SiCr, Cr, Al).

Four Point Probe - 2

QuadPro Four Point Probe Measurement System with heat controlled chuck.

Evaporator -1

AJA e-beam evapoator (Ti, Cr, Pt, Au, Al) 4-6".

Sputter - 1

Bestec Manual Loading (Cr, Ti, NiCr, Au) 4-6".

RIE - 2

SPTS Omega i2L APS RIE 6"-8" Wafers (SiO2, SixNy, polyimide).

Wire Bonder - 1

Kluicke & Soffa Manual Universal Thermosonic Gold Ball Bonder Model 4124.

Wafer Dicer - 1

DISCO DAD 321 Silicon, glass, silicon-to-glass bonded and GaAs substrates, up to 6".

Critical Point Dryer - 1

TOUSIMIS 915B CRITICAL POINT DRYER, 4-6".

Wire Bonder - 3

Delvotec Au ball bonder (Semi-Auto).

Pick & Place Tools

Essemtec UP3100 manual placement system for BGA, CSP, and Fine Pitch components.

Stress Measurement

TOHO TECHNOLOGY FLX-2320-S Wafer-Level Stress Measurement System.

Critical Point Dryer - 2

TOUSIMIS 916B CRITICAL POINT DRYER, 4-6-8".

Grinder

Strasbaugh 7AF 4-6-8" Wafer grinder.

Funding
National Public Funding Organisations
EU - 7th Framework Programme for Research and Technological Development
Turkish Scientific and Technological Research Council (TUBITAK)
Turkish Ministry of Science, Technology, and Industry
EU-FP6
Turkish Ministry of Development
Date of last update: 17/03/2014